ICSP 2025 — International Conference on Shot Peening
Augmentus joins ICSP 2025 at Purdue University, 22–25 September.
The International Conference on Shot Peening (ICSP) is the global gathering point for shot-peening process engineers, researchers, and equipment vendors. ICSP 2025 runs from 22 to 25 September at Purdue University in Indiana — and Augmentus will be on the floor.
Who we're sending
CEO Daryl Lim and Account Executive Justin Lind will be at the booth. If you run a peening cell — turbine blades, landing gear, automotive springs, weldments — they'd like to walk through how scan-driven toolpath generation can collapse SKU-onboarding time without sacrificing almen consistency.
What we'll be showing
We'll have the Augmentus platform running live, with examples of scan-to-path on representative peening geometries. The demo focuses on the workflow that matters in production: bringing in a part, scanning it, generating a peening toolpath, and running it — without writing or re-teaching a single line of robot code.
If you'd like to set up a meeting before the show, reach out via the demo form and we'll coordinate a time at Purdue.
